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| Name | Last modified | Size | Description |
|---|---|---|---|---|
| Parent Directory | - | ||
| kapur IEDM04.pdf | 2006-05-24 13:48 | 1.7M | |
| isolationSmeys.pdf | 2003-04-21 13:30 | 283K | |
| WooTED2-02.pdf | 2003-04-14 18:06 | 204K | |
| WooTED1-02.pdf | 2003-04-14 18:06 | 225K | |
| Wilk_HighK.pdf | 2003-04-12 09:31 | 1.5M | |
| TrendsSlides.pdf | 2006-04-04 22:29 | 6.2M | |
| Trends.pdf | 2004-03-23 14:52 | 1.7M | |
| TSUPREM4_Slides.pdf | 2004-04-27 11:05 | 143K | |
| TSUPREM4.pdf | 2004-04-27 11:05 | 72K | |
| Strained Silicon Technology.pdf | 2005-05-20 10:44 | 2.1M | |
| Silicides.pdf | 2004-04-28 16:11 | 2.2M | |
| Silicides & Metal gate Slides.pdf | 2005-04-28 15:56 | 3.6M | |
| Shallow Junctions Slides.pdf | 2006-04-10 16:46 | 4.9M | |
| ShallowJunctions.pdf | 2006-04-10 16:39 | 1.2M | |
| SCOTT CROWDER.PDF | 2006-05-24 13:46 | 2.2M | |
| Robertson JAP04.pdf | 2005-04-28 16:13 | 2.0M | |
| Rim IEEE TED2000.pdf | 2005-05-29 13:33 | 220K | |
| Rim IEDM95.pdf | 2005-05-29 13:33 | 355K | |
| PowerModeling.pdf | 2004-04-23 07:25 | 59K | |
| Plummer.pdf | 2003-04-03 16:57 | 722K | |
| PWong_BeyondMOS.pdf | 2003-05-29 22:59 | 2.1M | |
| Ohmic_Contacts_Slides.pdf | 2005-04-25 22:45 | 1.8M | |
| Ohmic_Contacts.pdf | 2004-04-13 23:09 | 1.6M | |
| NitOx_Kwong.pdf | 2003-04-04 14:51 | 257K | |
| Nanoscale CMOS.pdf | 2003-04-03 17:04 | 1.5M | |
| Naeemi IEDM04.pdf | 2006-05-23 14:16 | 670K | |
| Miller_ProcIEEE.pdf | 2003-06-02 14:18 | 336K | |
| LokeCh3.pdf | 2003-05-13 17:41 | 58K | |
| LokeCh2.pdf | 2003-05-13 17:41 | 192K | |
| LokeCh1.pdf | 2003-05-13 17:41 | 2.5M | |
| King JAP2002.pdf | 2005-04-28 16:13 | 210K | |
| Kapur2.pdf | 2003-05-13 17:40 | 313K | |
| Kapur1.pdf | 2003-05-13 17:40 | 383K | |
| Isolation.pdf | 2004-05-17 12:06 | 2.0M | |
| Interconnect_Havemann.pdf | 2003-05-13 17:38 | 1.1M | |
| Interconnect_Future.pdf | 2006-05-23 14:02 | 9.2M | |
| Interconnect_Cu.pdf | 2006-05-15 11:09 | 4.0M | |
| Interconnect_Al.pdf | 2004-04-27 15:33 | 2.5M | |
| InterconnectThermalModeling.pdf | 2004-04-23 07:25 | 120K | |
| InterconnectScalingThermal.pdf | 2004-04-23 07:25 | 231K | |
| InterconnectScalingSlides.pdf | 2006-05-11 17:59 | 4.5M | |
| Interconnect Scaling.pdf | 2006-05-11 18:01 | 1.9M | |
| Interconnect Lowk.pdf | 2006-05-18 17:58 | 2.6M | |
| Interconnect Cu Slides.pdf | 2006-05-15 11:00 | 2.6M | |
| Interconnect Al Slides.pdf | 2006-05-08 14:28 | 2.7M | |
| Intel_30nm.pdf | 2003-04-03 16:58 | 1.7M | |
| Intel Strained-Si-IEDM03.pdf | 2005-05-29 13:35 | 511K | |
| Intel Strain Si EDL04.pdf | 2005-05-29 13:35 | 137K | |
| IBM_Silicides_Mann.pdf | 2003-05-13 17:38 | 2.0M | |
| Hutchby_ProcIEEE03.pdf | 2005-05-29 13:57 | 1.0M | |
| Gate_Dielectric_Slides_Part2.pdf | 2005-04-07 15:53 | 4.4M | |
| Gate_Dielectric_Slides_Part1.pdf | 2005-04-04 18:18 | 2.4M | |
| GateOx_Yang.pdf | 2003-04-04 14:37 | 235K | |
| GateOx_Schuegraf.pdf | 2003-04-04 14:37 | 613K | |
| GateOx_Momose.pdf | 2003-04-04 14:30 | 294K | |
| GateOx_Gupta.pdf | 2003-04-04 15:03 | 115K | |
| GateOxNO_Kwong.pdf | 2003-04-04 14:52 | 721K | |
| GateDielectric.pdf | 2004-04-09 23:15 | 2.6M | |
| Future Devices 3.pdf | 2006-06-05 14:43 | 5.6M | |
| Future Devices 2.pdf | 2006-06-01 22:00 | 4.3M | |
| Future Devices.pdf | 2005-05-26 13:17 | 9.9M | |
| ExamExampleMidterm.pdf | 1999-05-03 12:35 | 71K | |
| ExamExample.pdf | 2001-05-21 10:40 | 305K | |
| Deposition_Planarization.pdf | 2004-05-20 14:16 | 1.5M | |
| Cu_Interconnect_Slides.pdf | 2005-05-07 16:16 | 3.6M | |
| Contacts.pdf | 2003-04-17 17:24 | 683K | |
| BORKAR.PDF | 2006-05-24 13:46 | 1.1M | |
| 3DProc_IEEE.pdf | 2003-06-02 14:23 | 722K | |